semiconductor

HANDLER

IC Handler - Pioneer Semiconductor Machine Co., Ltd

  • IC Handler

    NS8080MS IC Test Handler

    High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

    • Up to 8 sites testing capability
    • Testing area from 264mm x 149mm
    • Up to 240kgf contact force
    • UPH – up to 13,500 (Ambient) &
    • Up to 8,200 (High Temperature)
MODEL NO. NS8160MS NS8080MS NS8080SH
Devices Handled QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1
Test Mode 16-site (8 x 2)
N/A
8-site (4 x 2)
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single
 
Testing Area 264 x 149 mm 184 x 149 mm
Standard Socket Pitch (mm) X: 30 Y: 60 X: 40 Y: 60
Heating Method Heating Plate
Index Time 0.42 sec (up to 160 kgf)*2 0.4 sec (up to 120 kgf)*2
0.58 sec (up to 240 kgf)*2 N/A
Maximum Throughput (units per hour)
Ambient Temperature

13,500 units
High Temperature 8,200 units
Binning Max. 6 bins (Auto 3, Manual 3)
Tray Size JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure 240 kgf 120 kgf
Temperature Accuracy 50 - 90°C ±2°C
90 - 155°C ±3°C
Power Single Phase 200 - 240 V AC, 50/60 Hz, 6 kVA
Handler Dimensions (D x W x H) 1,500 x 1,860 x 2,000 mm *3
Weight 1,090kg
  • IC Handler

    NS8080SH IC Test Handler

    High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

    • Up to 8 sites testing capability
    • Testing area from 184mm x 149mm
    • Up to 120Kgf contact force
    • UPH - up to 13,500 (ambient) &
    • Up to 8,200 (High Temperature)
  • IC Handler

    NS8160MS IC Test Handler

    High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

    • Up to 16 site testing capability
    • Testing area from 264mmx 149mm
    • Up to 240kgf contact force
    • UPH - up to 13,500 (Ambient) &
    • Up to 8,200 (High Temperature)
  • IC Handler

    NX1032XS IC Test Handler

    Developed using leading-edge robot technology, this IC test handler boasts significantly improved performance to support even the most demanding tests.

    • Up to 32 site testing capability
    • Testing area from 344mm x 244mm
    • Up to 480kgf contact force
    • UPH - up to 20,000 (Ambient) &
    • Up to 10,500 (High Temperature)
MODEL NUMBER NX1032XS
Devices Handled 16-site 32-site
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA,
Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) *1
Test Mode N/A 32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch)
8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm)
4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm)
2-site (Socket pitch 80 mm)
Single (use one side of the 2-site test)
Non-standard pitches can be set by laying out the independent compliance unit with desired pitches
Testing Area 344 × 146 mm 344 × 244 mm
Standard Socket Pitch (mm) X: 40mm Y: 60mm
Heating Method Heat Press Method
Index Time *2
(common in Ambient and High Temperature modes)
Min. 0.38sec
Approx. 0.42sec. (wide 4×2, 8×2 layout) Approx. 2.05sec. (8×4 layout)
Approx. 2.21sec. (4,800N Option) Approx. 4.35sec. (4,800N Option)
Max. Contact Force 1,600N (Optional) or 4,800N (Standard) 3,200N (Optional) or 4,800N (Standard)
Maximum Throughput (units per hour)
Ambient Temperature

8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000
High Temperature 8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500
Binning Max. 6 bins (Auto 3, Manual 3)
Tray JEDEC (135.9 × 315.0 mm)
Temperature Accuracy 50 - 90°C ±2°C
90 - 155°C ±3°C
Hot Plate Size 220 × 380 mm *3
Power Requirement Single Phase 200 - 240 V AC, 50/60 Hz, 6 kVA
Handler Dimensions (D x W x H) 1,580 x 1,940 x 2,000 mm *4
Weight Approx. 1,200kg