IC Handler

IC Handler

NX1032XS IC Test Handler

Developed using leading-edge robot technology, this IC test handler boasts significantly improved performance to support even the most demanding tests.
- Up to 32 site testing capability
- Testing area from 344mm x 244mm
- Up to 480kgf contact force
- UPH - up to 20,000 (Ambient)
- Up to 10,500 (High Temperature)
Type: NX1032XS

	NX1032XS
Devices Handled	16-site	32-site
	QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA, Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) ^*1
Test Mode	N/A	32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
	16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch) 8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm) 4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm) 2-site (Socket pitch 80 mm) Single (use one side of the 2-site test) Non-standard pitches can be set by laying out the independent compliance unit with desired pitches
Testing Area	344 × 146 mm	344 × 244 mm
Standard Socket Pitch (mm)	X: 40mm Y: 60mm
Heating Method	Heat Press Method
*Index Time ^2** (common in Ambient and High Temperature modes)	Min. 0.38sec
	Approx. 0.42sec. (wide 4×2, 8×2 layout)	Approx. 2.05sec. (8×4 layout)
	Approx. 2.21sec. (4,800N Option)	Approx. 4.35sec. (4,800N Option)
Max. Contact Force	1,600N (Optional) or 4,800N (Standard)	3,200N (Optional) or 4,800N (Standard)
Maximum Throughput (units per hour)	8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000(ambient temperature) 8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500(high temperature)
Binning	Max. 6 bins (Auto 3, Manual 3)
Tray	JEDEC (135.9 × 315.0 mm)
Temperature Accuracy	+50°C to +90°C ±2°C +90°C to 155°C ±3°C
Hot Plate Size	220mm × 380 mm ^*3
Power Requirement	Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H)	1,580(W) x 1,940(D) x 2,000(H) ^*4
Weight	Approx. 1,200kg
Note: 1:Depends on socker size and socker pitch. 2:Depends on the socker mounting height. 3:Excluding handle, tower light, and LCD monitor. 4:Contact us for temperature accuracy of NS8080SH- 8-site.

$NS8080SH \ NS8040SH$
IC Handler

NS8080SH \ NS8040SH IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.
- Up to 4/8 sites testing capability
- Testing area from 184mm x 149mm
- Up to 120kgf contact force
- UPH - up to 13,500 (ambient)
- Up to 8,200 (High Temperature)
Type: NS8080SH \ NS8040SH

	NS8160MS	NS8080MS	NS8080SH	NS8040SH
Devices Handled	QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) ^*1
Test Mode	16-site (8 x 2)	N/A	N/A	N/A
	8-site (4 x 2)			N/A
	Square 4-site (2 x 2) In-Line 4-site (4 x 1) 2-site Single
Testing Area	264 mm x 149 mm		184 mm x 149 mm
Standard Socket Pitch (mm)	X: 30 Y: 60(max X: 30 Y: 63.5)	X: 40 Y: 60(max X: 60 Y: 63.5)	X: 40 Y: 60	X: 80 Y: 60
Heating Method	Heating Plate
Index Time	0.42 sec (up to 160 kgf)^*2		0.4 sec (up to 120 kgf)^*2
	0.58 sec (up to 240 kgf)^*2		N/A
Maximum Throughput (units per hour)	13,500 units(ambient temperature) 8,200 units(high temperature)		10,000 units(ambient Temperature) 6,100 units(high temperature)
Binning	Max. 6 bins (Auto 3, Manual 3)
Tray Size	JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure	240 kgf		120 kgf
Temperature Accuracy	+50°C to +90°C ±2°C ^4 +90°C to +155°C ±3°C ^4			+50°C to +90°C ±2°C +90°C to +130°C ±3°C
Power	Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H)	1,850(W) x 1,500(D) x 1,970(H) ^*3		1,850(W) x 1,500(D) x 1,850(H) ^*3
Weight	Approx. 1,090kg		Approx. 1,000kg
Note: 1:Depends on socker size and socker pitch. 2:Depends on the socker mounting height. 3:Excluding handle, tower light, and LCD monitor. 4:Contact us for temperature accuracy of NS8080SH- 8-site.

$NS8160MS \ NS8080MS$
IC Handler

NS8160MS \ NS8080MS IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.
- Up to 16\8 sites testing capability
- Testing area from 264mm x 149mm
- Up to 240kgf contact force
- UPH – up to 13,500 (Ambient)
- Up to 8,200 (High Temperature)
Type: NS8160MS \ NS8080MS

	NS8160MS	NS8080MS	NS8080SH	NS8040SH
Devices Handled	QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) ^*1
Test Mode	16-site (8 x 2)	N/A	N/A	N/A
	8-site (4 x 2)			N/A
	Square 4-site (2 x 2) In-Line 4-site (4 x 1) 2-site Single
Testing Area	264 mm x 149 mm		184 mm x 149 mm
Standard Socket Pitch (mm)	X: 30 Y: 60(max X: 30 Y: 63.5)	X: 40 Y: 60(max X: 60 Y: 63.5)	X: 40 Y: 60	X: 80 Y: 60
Heating Method	Heating Plate
Index Time	0.42 sec (up to 160 kgf)^*2		0.4 sec (up to 120 kgf)^*2
	0.58 sec (up to 240 kgf)^*2		N/A
Maximum Throughput (units per hour)	13,500 units(ambient temperature) 8,200 units(high temperature)		10,000 units(ambient Temperature) 6,100 units(high temperature)
Binning	Max. 6 bins (Auto 3, Manual 3)
Tray Size	JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure	240 kgf		120 kgf
Temperature Accuracy	+50°C to +90°C ±2°C ^4 +90°C to +155°C ±3°C ^4			+50°C to +90°C ±2°C +90°C to +130°C ±3°C
Power	Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H)	1,850(W) x 1,500(D) x 1,970(H) ^*3		1,850(W) x 1,500(D) x 1,850(H) ^*3
Weight	Approx. 1,090kg		Approx. 1,000kg
Note: 1:Depends on socker size and socker pitch. 2:Depends on the socker mounting height. 3:Excluding handle, tower light, and LCD monitor. 4:Contact us for temperature accuracy of NS8080SH- 8-site.

semiconductor

HANDLER

NX1032XS IC Test Handler

Type: NX1032XS

IC Handler

NS8080SH \ NS8040SH IC Test Handler

Type: NS8080SH \ NS8040SH

IC Handler

NS8160MS \ NS8080MS IC Test Handler

Type: NS8160MS \ NS8080MS

semiconductor

HANDLER

IC Handler

NX1032XS IC Test Handler

Type: NX1032XS Detail

IC Handler

NS8080SH \ NS8040SH IC Test Handler

Type: NS8080SH \ NS8040SH Detail

IC Handler

NS8160MS \ NS8080MS IC Test Handler

Type: NS8160MS \ NS8080MS Detail

Type: NX1032XS

Type: NS8080SH \ NS8040SH

Type: NS8160MS \ NS8080MS