NST Handler
SIMPLE AND INTELLIGENT

NS Technologies

NS Technologies is a wholly-owned subsidiary that was founded by Kanematsu and received transfer of all assets related to the Epson IC test handler business, and are continuing to operate this business as a specialist manufacturer. We also have constructed a system for providing the same services that existed before by retaining the same production and sales system both in Japan and overseas.

NX1032XS IC Test Handler

Supporting the global semiconductor with IC Test Handlers that deliver High-Speed and Stable Operation

IC Handler
  • Up to 32 site testing capability
  • Testing area from 344mm x 244mm
  • Up to 480kgf contact force
  • UPH - up to 20,000 (Ambient)
  • Up to 10,500 (High Temperature)

Developed using leading-edge robot technology, this IC test handler boasts significantly improved performance to support even the most demanding tests.

SPECIFICATIONS

NX1032XS
Devices Handled 16-site 32-site
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA,
Min. 3×3 to Max. 50×50 (Lead pitch: 0.4mm or more) *1
Test Mode N/A 32-site (8×4, X: 40mm pitch × Y: 60mm pitch)
16-site (8×2, X: 30mm pitch Y: 60mm pitch, 40mm pitch × Y: 60mm pitch)
8-site (4×2, X: 40mm pitch × Y: 60mm, X: 60mm pitch × Y: 60mm, X: 80mm pitch × Y: 60mm)
4-site (2×2, X: 80mm × Y: 60mm), (4×1, X: 40mm, 60mm, 80mm)
2-site (Socket pitch 80 mm)
Single (use one side of the 2-site test)
Non-standard pitches can be set by laying out the independent compliance unit with desired pitches
Testing Area 344 × 146 mm 344 × 244 mm
Standard Socket Pitch (mm) X: 40mm Y: 60mm
Heating Method Heat Press Method
Index Time *2
(common in Ambient and High Temperature modes)		 Min. 0.38sec
Approx. 0.42sec. (wide 4×2, 8×2 layout) Approx. 2.05sec. (8×4 layout)
Approx. 2.21sec. (4,800N Option) Approx. 4.35sec. (4,800N Option)
Max. Contact Force 1,600N (Optional) or 4,800N (Standard) 3,200N (Optional) or 4,800N (Standard)
Maximum Throughput (units per hour) 8×4 and 8×2 layouts: 20,000, 4×2 layout: 15,000(ambient temperature)
8×4 and 8×2 layouts: 10,500, 4×2 layout:10,500(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray JEDEC (135.9 × 315.0 mm)
Temperature Accuracy +50°C to +90°C ±2°C
+90°C to 155°C ±3°C
Hot Plate Size 220mm × 380 mm *3
Power Requirement Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,580(W) x 1,940(D) x 2,000(H) *4
Weight Approx. 1,200kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.

NS8080SH / NS8040SH IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

IC Handler
  • Up to 4/8 sites testing capability
  • Testing area from 184mm x 149mm
  • Up to 120kgf contact force
  • UPH - up to 13,500 (ambient)
  • Up to 8,200 (High Temperature)

SPECIFICATIONS

NS8160MS NS8080MS NS8080SH NS8040SH
Devices Handled QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1
Test Mode 16-site (8 x 2)
 N/A N/A N/A
8-site (4 x 2) N/A
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single
Testing Area 264 mm x 149 mm 184 mm x 149 mm
Standard Socket Pitch (mm) X: 30 Y: 60(max X: 30 Y: 63.5) X: 40 Y: 60(max X: 60 Y: 63.5) X: 40 Y: 60 X: 80 Y: 60
Heating Method Heating Plate
Index Time 0.42 sec (up to 160 kgf)*2 0.4 sec (up to 120 kgf)*2
0.58 sec (up to 240 kgf)*2 N/A
Maximum Throughput (units per hour)
 13,500 units(ambient temperature)
8,200 units(high temperature)		 10,000 units(ambient Temperature)
6,100 units(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray Size JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure 240 kgf 120 kgf
Temperature Accuracy +50°C to +90°C ±2°C *4
+90°C to +155°C ±3°C *4		 +50°C to +90°C ±2°C
+90°C to +130°C ±3°C
Power Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,850(W) x 1,500(D) x 1,970(H) *3 1,850(W) x 1,500(D) x 1,850(H) *3
Weight Approx. 1,090kg Approx. 1,000kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.

NS8160MS / NS8080MS IC Test Handler

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

IC Handler
  • Up to 4/8 sites testing capability
  • Testing area from 184mm x 149mm
  • Up to 120kgf contact force
  • UPH - up to 13,500 (ambient)
  • Up to 8,200 (High Temperature)

SPECIFICATIONS

NS8160MS NS8080MS NS8080SH NS8040SH
Devices Handled QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1
Test Mode 16-site (8 x 2)
 N/A N/A N/A
8-site (4 x 2) N/A
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single
Testing Area 264 mm x 149 mm 184 mm x 149 mm
Standard Socket Pitch (mm) X: 30 Y: 60(max X: 30 Y: 63.5) X: 40 Y: 60(max X: 60 Y: 63.5) X: 40 Y: 60 X: 80 Y: 60
Heating Method Heating Plate
Index Time 0.42 sec (up to 160 kgf)*2 0.4 sec (up to 120 kgf)*2
0.58 sec (up to 240 kgf)*2 N/A
Maximum Throughput (units per hour)
 13,500 units(ambient temperature)
8,200 units(high temperature)		 10,000 units(ambient Temperature)
6,100 units(high temperature)
Binning Max. 6 bins (Auto 3, Manual 3)
Tray Size JEDEC (135.9 x 315.0 mm)
Max. Contact Pressure 240 kgf 120 kgf
Temperature Accuracy +50°C to +90°C ±2°C *4
+90°C to +155°C ±3°C *4		 +50°C to +90°C ±2°C
+90°C to +130°C ±3°C
Power Single Phase AC 200 - 240 V, 50/60 Hz, 6 kVA
Handler Dimensions (mm) (W x D x H) 1,850(W) x 1,500(D) x 1,970(H) *3 1,850(W) x 1,500(D) x 1,850(H) *3
Weight Approx. 1,090kg Approx. 1,000kg
Note:

*1:Depends on socker size and socker pitch.
*2:Depends on the socker mounting height.
*3:Excluding handle, tower light, and LCD monitor.
*4:Contact us for temperature accuracy of NS8080SH- 8-site.
NST Handler
© Pioneer Semiconductor Machine Co., Ltd.